Facilities

Chip / Device Level R&D and Manufacture on Micro and Nanotechnology devices and MEMS

The Micro and Nanotechnology Centre clean room facilities provide an excellent base for chip and device level R&D and manufacture for Micro and Nanotechnology devices and process development. Facilities and tools are available to allow complete MNT sub assemblies to be developed and produced.

Capabilities

• Lithography – E-beam and Optical
• Screen and Stencil printing
• Deposition - Wet & dry oxidation, LPCVD, thermal evaporation, sputter coating
• Etching – Reactive Ion Etch, Deep RIE & wet etch
• Chemical Mechanical Polishing
• Wafer Cleaning
• Metrology and Test
• Dicing / Die Attach – Bump and wire-bonding
• Wafer bonding
• Indium evaporation & bump bonding for high density interconnect
• Packaging
• Nano materials development and handling - Specialized glove boxes
• Centrifugal sedimentation of nanomaterials
• Electrospinning of nanofibres
• Electroplating Centre
• Powder blasting for MNT/microelectronic devices

All on one site via the Micro and Nanotechnology Centre.

For further information contact Ian Clarke