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Advanced Device Packaging & MEMS Technologies - 18 November 2008
Science and Technology Facilities Council
KITE Club Workshop
Advanced Device Packaging & MEMS Technologies
Workshop
Tuesday 18th November 2008, 76 Portland Place,
London
Two critical technologies that are being developed for space applications -
Advanced Packaging and Microelectromechanical Systems (MEMS) - also have
significant commercial applications for industry. Both these technologies
result in miniaturisation of essential sensors and electronic components. MEMS
devices are the integration of electrical devices and mechanical structures at
the micrometer level. Many different types of MEMS device are being fabricated
for a variety of space related applications, including microsensors, navigation
systems (accelerometers, gyros), filters, optical components and more.
The event featured presentations from both industry and the academic
community. Speakers from the European Space Agency and EADS Astrium lead the
programme, with an overview of the technology landscape from a space
perspective. This was followed by presentations from Heriot-Watt and Imperial
College, which included information about developments in 3D device packaging
techniques and a novel interconnect technology respectively. After an
opportunity to network over lunch, the afternoon session included examples of
how MEMS technologies developed at the Rutherford Appleton Laboratories have
found commercial success, and how Southampton University continue to develop
leading edge nanofabrication methods despite a devastating laboratory fire. To
round off the formal side of the event, representatives from Sensing Systems
and GE Aviation provided an industrial perspective and identified some points
that developers of new devices should consider to ensure commercial
success.
The event was very popular, attracting 75 delegates on the day which filled
the venue close to capacity. Many took the opportunity to stay on after the
talks to continue networking with fellow delegates. A number of academics who
attended were funded by the EPSRC and the event gave them useful insights and
information on STFC projects and possibilities.
Programme
|
Time
|
Programme
|
Speaker
|
| 10:00 - 10:30 |
Registration and coffee |
| 10:30 - 10:45 |
Welcome |
Penny
Woodman (PDF - 204kB - link opens in a new window), STFC |
| 10:45 - 11:15 |
European Space Agency activities in packaging & MEMS |
Fabien
Filhol (PDF - 574kB - link opens in a new window), ESTEC, European Space Agency |
| 11:15 - 11:45 |
Space technology presentation (title to be confirmed) |
Ralph Green (PDF - 2316kB - link opens in a new window),
EADS Astrium |
| 11:45 - 12:05 |
Coffee break |
| 12:05 - 12:25 |
Advanced MEMS Devices for Space Environments |
Dr Tom Pike (PDF - 5018kB - link opens in a new window),
Imperial College, London |
| 12:25 - 12:45 |
Assembly & Packaging Solutions for 3D Miniaturised
Integrated Products |
Prof Mark
Desmulliez (PDF - 2008kB - link opens in a new window), Herriot Watt University |
| 12:45 - 13:00 |
Introduction to STFC Knowledge Exchange Service |
STFC Knowledge Exchange Service (PDF - 107kB - link opens in a new window)
|
| 13:00 - 14:00 |
Lunch and networking |
| 14:00 - 14:20 |
Advanced MEMS R&D |
Prof Mark
Spearing (PDF - 2250kB - link opens in a new window), University of Southampton |
| 14:20 - 14:40 |
MEMS Technologies at Rutherford Appleton Laboratory |
Dr Bob Stevens (PDF - 1930kB - link opens in a new window), Rutherford Appleton Laboratory |
| 14:40 - 15:00 |
Industrial MEMS Product Development |
Eric Whitley (PDF - 315kB - link opens in a new window),
Atlantic Inertial Systems |
| 15:00 - 15:20 |
Challenges for MEMS Packaging |
Steve Riches (PDF - 2790kB - link opens in a new window),
GE Aviation |
| 15:20 - 15:30 |
Summary and close |
STFC |
| 15:30 - 16:30 |
Refreshments and networking |
The talks are followed by short Q&A sessions.
Page last updated: 08 December 2009
by Angela Pottinger